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Rapid Prototyping
High Precision Rapid Prototypes.
    Envisiontec Perfactory
  • If you have a need for a high tolerance ultra fine detail part the Perfactory is your answer. Our perfactory machine works on the principals of polymersation to create your prototype layer by layer. Utilizing a Texas Instruments’ DLP (Digital Light Process) chip, the perfactory uses a layer mask to project a 1280 x 1024 pixel cross section image of your part onto a bath of resin. In high resolution configuration each pixel is as fine as 32 micron (0.0012”) in the X and Y axis and as low as 20 micron (0.0008”) in the Z axis.This technology has the ability to process a high tolerance part in a short amount of time.
overview

The perfactory machine works on the principals of polymersation to create your prototype layer by layer. Utilizing a Texas Instruments' DLP (Digital Light Process) chip, the perfactory uses a layer mask to project a 1280 x 1024 pixel cross section image of your part onto a bath of resin. In high resolution configuration each pixel is as fine as 32 micron (0.0012") in the X and Y axis and as low as 20 micron (0.0008") in the Z axis.

    resins
    R11
  • Perfactory R11 is a liquid photopolymer that produces robust, accurate and functional parts using stereolithography machines. The material offers superior chemical resistance, a wide processing latitude, and excellent tolerance to a broad temperature and humidity range during and after build.


    Eshell
  • E-shell 100 is a medium viscosity liquid photopolymer that produces strong, tough, water-resistant parts that are biocompatible. Parts created with E-Shell 100 have a beige colour, opaque appearance similar to production plastics and can be used in medical applications such as shell manufacturing in the hearing aid industry, or bio medical components.

    PIC100
  • The PIC-100 liquid photopolymer is a resin that melts into a liquid wax-like material during investment casting without the need for any high temperature burnout cycles. While there are other wax-based materials on the market, they tend to be far more brittle and harder to finish when compared with the models built on the Perfactory system using the PIC-100 resin.

    specifications
Envisiontec Perfactory
  • Technology:
  • Digital Light Projection (SXGA)
  • Photopolymerization
  • Maximum Model Size:
  • W190 mm x D152mm x H230 mm (xyz)
  • W7.5" x D6" x H9" (xyz)
  • Resolution:
  • 0.0062" - 0.0036" (xy)
  • Layer Thickness 0.0005" - 0.0058" (z)
  • SXGA 1024 x 768 (pixels)
  • Materials:
  • R11, Eshell, PIC100 Resins
Resin Tensile Strength mpa Elongation at Break % Modulus of Elasticity mpa Flexural Strength mpa Flexural Modulus mpa
R11 50 41.6 --- 75 2450
Eshell --- 6.5 --- 96 2230
Pic100 --- --- --- --- ---