
- Envisiontec Perfactory
- If you have a need for a high tolerance ultra fine detail part the Perfactory is your answer. Our perfactory machine works on the principals of polymersation to create your prototype layer by layer. Utilizing a Texas Instruments’ DLP (Digital Light Process) chip, the perfactory uses a layer mask to project a 1280 x 1024 pixel cross section image of your part onto a bath of resin. In high resolution configuration each pixel is as fine as 32 micron (0.0012”) in the X and Y axis and as low as 20 micron (0.0008”) in the Z axis.This technology has the ability to process a high tolerance part in a short amount of time.
overview
The perfactory machine works on the principals of polymersation to create your prototype layer by layer. Utilizing a Texas Instruments' DLP (Digital Light Process) chip, the perfactory uses a layer mask to project a 1280 x 1024 pixel cross section image of your part onto a bath of resin. In high resolution configuration each pixel is as fine as 32 micron (0.0012") in the X and Y axis and as low as 20 micron (0.0008") in the Z axis.
- resins
- R11
- Perfactory R11 is a liquid photopolymer that produces robust, accurate and functional parts using stereolithography machines. The material offers superior chemical resistance, a wide processing latitude, and excellent tolerance to a broad temperature and humidity range during and after build.
- Eshell
- E-shell 100 is a medium viscosity liquid photopolymer that produces strong, tough, water-resistant parts that are biocompatible. Parts created with E-Shell 100 have a beige colour, opaque appearance similar to production plastics and can be used in medical applications such as shell manufacturing in the hearing aid industry, or bio medical components.
- PIC100
- The PIC-100 liquid photopolymer is a resin that melts into a liquid wax-like material during investment casting without the need for any high temperature burnout cycles. While there are other wax-based materials on the market, they tend to be far more brittle and harder to finish when compared with the models built on the Perfactory system using the PIC-100 resin.
- specifications
Envisiontec Perfactory
- Technology:
- Digital Light Projection (SXGA)
- Photopolymerization
- Maximum Model Size:
- W190 mm x D152mm x H230 mm (xyz)
- W7.5" x D6" x H9" (xyz)
- Resolution:
- 0.0062" - 0.0036" (xy)
- Layer Thickness 0.0005" - 0.0058" (z)
- SXGA 1024 x 768 (pixels)
- Materials:
- R11, Eshell, PIC100 Resins
| Resin | Tensile Strength mpa | Elongation at Break % | Modulus of Elasticity mpa | Flexural Strength mpa | Flexural Modulus mpa |
R11 |
50 | 41.6 | --- | 75 | 2450 |
Eshell |
--- | 6.5 | --- | 96 | 2230 |
Pic100 |
--- | --- | --- | --- | --- |
